High temperature thermal tape fab

Tue, 30 Jun 2026 05:06:28 +0800

On the fab floor, the photoresist bake isn’t a “warm-up.” It’s the thermal step that sets linewidth control. A 0.5°C drift will shift the dose window, and a hot zone that isn’t uniform prints sloped sidewalls that will come back to haunt you in resist strip and etch. We built our high-temperature thermal tape system for that reality: hold the wafer at the target temperature—across the whole surface—and do it hour after hour without adding particles or variability. What matters, technically We use short-wave infrared (NIR) heating paired with low-thermal-mass tape fixtures, so soft bake and hard bake hit wafer-level uniformity within ±0.1°C. You can control ramp rates up to 3°C/s without overshoot, which protects thin films and keeps thermal budget under control. The tape is formulated for high-temperature stability and clean release, and it’s verified to generate zero particles in Class 1–100 environments. Repeatability is ±0.2°C across tool-to-tool transfers, so your process window doesn’t drift when you scale. In lithography lines, you need bake profiles that repeat—shift after shift, lot after lot, machine after machine. The tape system stabilizes the interface between wafer and hot plate, and that consistent thermal contact helps reduce reflective notching and edge bead effects. The payoff shows up where it counts: tighter CD distributions, fewer reworks after develop inspection, and less scrap from residual film at the edges. You also get a practical win on uptime and energy. NIR heats only the target zone, so energy use drops. And when it’s time to change consumables, the path is straightforward and predictable—fewer surprises, less unplanned downtime. A couple of things to keep in mind. The tape chemistry plays nicely with standard photoresists and solvents, but it can be sensitive to prolonged exposure to strong bases in some strip chemistries. Run your post-bak clean sequence through validation before you ramp volume. Installation comes down to matching chuck geometry and the emissivity of the wafer backside. We provide calibration recipes for the common platforms to speed integration and lock in that ±0.1°C uniformity from day one.

Tape on Infrared Heating Zone Solutions

High temperature thermal tape fab