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		<title>填充不足 on Infrared Heating Zone Solutions</title>
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			<lastBuildDate>Fri, 03 Jul 2026 08:41:44 +0800</lastBuildDate>
		
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				<title>半导体IR材料的底胶固化</title>
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				<pubDate>Fri, 03 Jul 2026 08:41:44 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://ir-heat-zone.com/images/0a976f8a438e1a813cc995e9355a4471.png&#34; alt=&#34;半导体IR材料的底胶固化&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;在后端制造过程中，填充物不足或填充不均的问题并非仅仅是外观上的缺陷。这些缺陷会直接导致产品性能下降，表现为电气故障、机械疲劳以及产品在使用过程中的失效。如果基于红外线的固化工艺无法为每种基板、封装结构以及不同批次的产品提供一致的热处理条件，那么整个生产流程就会变得不可控。&lt;/p&gt;</description>
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