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		<title>结合 on Infrared Heating Zone Solutions</title>
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				<title>翻转芯片键合加热灯</title>
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				<pubDate>Mon, 01 Jun 2026 02:27:12 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://ir-heat-zone.com/images/016cf4f616aaa15e4af48856b8adc51b.png&#34; alt=&#34;翻转芯片键合加热灯&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;车间内，倒装芯片键合机正在运转。拾取放置周期、灌封剂点胶以及热循环曲线需保持在严格范围内。当加热灯开始出现滑移时，问题立刻显现：基板上出现冷点、键合线气孔、金属间化合物变化——废品率随之上升。每一分钟的温度漂移都会影响良率，每一次非计划停机都会影响进度。&lt;/p&gt;</description>
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